This paper presents an overview of the current research trends in the field of substrate integrated waveguide (SIW) technology, with particular emphasis on the issues related to the emerging applications in the framework of the Internet of Things (IoT) and the fifth generation of mobile communication (5G). More specifically, different techniques adopted to miniaturize SIW cavities are described, with the aim of reducing the footprint of SIW components and filters. Moreover, the use of innovative materials, like paper, textile and 3D printed dielectric substrates, is presented and discussed, and the implementation of ecofriendly, wearable, and fully 3D structures is illustrated.
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